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  february 2008 rev 2 1/11 11 st2041 enhanced power switch features 90 m high-side mosfet switch 500 ma continuos current per channel thermal and short-circuit protection with overcurrent logic output operating range from 2.7 to 5.5 v cmos- and ttl-compatible enable inputs 2.5 ms typical rise time under voltage lock out 10 a maximum standby supply current ambient temperature range, 0 c to 85 c 2 kv esd protection fault-blanking description the st2041 power distribution switch is intended for applications where heavy capacitive loads and short circuits are likely to be encountered. these devices incorporate 90 m n-channel mosfet high-side power switches for power-distribution. the switch is controlled by a logic enable input. gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. when the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode , pulling the overcurrent logic output low. when continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. recovery from a thermal shutdown is automatic once the device has cooled sufficie ntly. internal circuitry ensures the switch remain s off until valid input voltage is present. so-8 table 1. device summary order code package packaging ST2041BDR so-8 tape and reel www.st.com
schematic diagram and pin connections st2041 2/11/11 1 schematic diagram and pin connections figure 1. schematic diagram figure 2. pin connections (top view) table 2. pin functions pin name type description 1gnd -ground 2in1 -v cc input, 2.7-5.5v 3in2 -v cc input, 2.7-5.5v 4 en_n i enable (active low) 5 oc o open drain output for fault indication 6out3 -output 7out2 -output 8out1 -output en_n en_n
st2041 functional descriptions 3/11 2 functional descriptions 2.1 fault blanking st devices feature a 10ms fault blanking. fault blanking allows current-limit faults, including momentary short-circuit faults that occur w hen hot-swapping a capacitive load, and also ensures that no fault is issued during power-up. when a load transient causes the device to enter current limit, an internal counter starts. if the load fault persists beyond the 10ms fault- blanking time-out, the fault output asserts low. load-transient faults less than 10ms (typical) will not cause a fault output assertion. only current-limit faults are blanked. die over-temperature faults and input voltage droops below the under voltage lock out (uvlo) threshold will cause an immediate fault output. 2.2 overcurrent/over-temperature protection in overcurrent or short-circuit condition, the switch limits the current at 500ma. if temperature of die goes above limit value, the switch turns off. 2.3 under voltage lock out (uvlo) when input voltage drops belo w critical value, the power switch turns off to prevent improper operation due to low voltage.
maximum rating st2041 4/11/11 3 maximum rating stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only, and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant quality documents. 3.1 recommended operating conditions table 3. absolute maximum ratings symbol parameter value unit v i input voltage range -0.3-6.0 v v o output voltage range -0.3-(vi+0.3) v vienx en input voltage range -0.3-6.0 v io continuous output current internally limited esd esd protection level 2 kv t j junction operating temperature -40 to 125 c t stg storage temperature -55 to 150 c table 4. recommended operating conditions symbol parameter min typ max unit v i input voltage 2.7 5.0 5.5 v v o output voltage 0 5.0 5.5 v i o continuous output current 0 - 500 ma
st2041 electrical characteristics 5/11 4 electrical characteristics table 5. electrical characteristics (t j = 25 c, v i = 5.0 v) symbol parameter test conditions min typ max unit r ds(on) static drain-source on-state resistance v i = 3.3 v -40 < t j < 125 c 100 145 m v i = 5.0 v -40 < t j < 125 c 90 135 v i = 3.3 v t j = 25 c 90 130 v i = 5.0 v t j = 25c 80 110 t r output rise time (1) 1. not tested in production, specified by design v i = 5.5 v r l = 10 c l = 1 f 2.5 ms v i = 2.7 v r l = 10 c l = 1 f 3ms t f output fall time (1) v i = 5.5 v r l = 10 c l = 1 f 0.3 ms v i = 2.7 v r l = 10 c l = 1 f 0.2 ms t on turn-on time (1) rl = 10 cl = 100 f 20 ms t off turn-off time (1) rl = 10 cl = 100 f 40 ms
electrical characteristics st2041 6/11/11 table 6. current limit characteristics (v i = 5.5 v, i o = rated current, t j = 25 c, unless otherwise specified.) symbol parameter test conditions min typ max unit i os short circuit output current v i = 5 v out connected to gnd, device enabled into short circuit 0.7 1.0 1.3 a table 7. supply current characteristics (v i = 5.5 v, i o = rated current, t j = 25 c, unless otherwise specified.) symbol parameter test conditions min typ max unit i off switch turned off no load 1.0 5.0 a no load; -40 < t j < 125c 10 a i on switch turned on no load 70 90 a no load; -40 < t j < 125c 100 a i leakage output leakage current output grounded, switch is off 10 a output grounded, switch is off; -40 < t j < 125c 20 a table 8. thermal characteristics (v i = 5.5 v, i o = rated current, t j = 25 c, unless otherwise specified.) symbol parameter test co nditions min typ max unit t1 thermal shutdown threshold 135 c t2 recovery from thermal shutdown 125 c hyst hysteresis 10 c table 9. uvlo characteristics (v i = 5.5 v, i o = rated current, t j = 25 c, unless otherwise specified.) symbol parameter test conditions min typ max unit v uvlo undervoltage lockout threshold 2.0 2.5 v hyst hysteresis 100 mv
st2041 electrical characteristics 7/11 table 10. oc pin characteristics (v i = 5.5 v, i o = rated current, t j = 25 c, unless otherwise specified.) symbol parameter test conditions min typ max unit oc blanking ocx assertion and de-assertion (1) 1. not tested in production, specified by design. 4815ms v o output low voltage 0.4 v i off off current 1.0 a table 11. en_n pin characteristics (v i = 5.5 v, i o = rated current, t j = 25 c, unless otherwise specified.) symbol parameter test conditions min typ max unit v ih high level input voltage v i = 2.7 to 5.5 v 2.0 v v il low level input voltage v i = 4.5 to 5.5 v 0.8 v v i = 2.7 to 4.5 v 0.4 v i i input current v ienx = 0 v or v i -0.5 0.5 a
package mechanical data st2041 8/11/11 5 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com . figure 3. so-8 package outline
st2041 package mechanical data 9/11 table 12. so-8 mechanical data symbol millimeters inches min typ max min typ max a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 a2 1.10 1.65 0.043 0.065 b 0.33 0.51 0.013 0.020 c 0.19 0.25 0.007 0.010 d 4.80 5.00 0.189 0.197 e 3.80 4.00 0.15 0.157 e 1.27 0.050 h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 l 0.40 1.27 0.016 0.050 k 8 (max.) ddd 0.10 0.004
revision history st2041 10/11/11 6 revision history table 13. document revision history date revision changes 05-may-2006 1 initial release. 20-feb-2008 2 document restructured and converted to new st template, watermark removed.
st2041 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorize representative of st, st products are not designed, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems, where failure or malfunction may result in personal injury, death, or severe property or environmental damage. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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